Transcription
Dell EMC PowerEdge C6520Technical GuideRegulatory Model: E64S SeriesRegulatory Type: E64S001December 2021Rev. A02
Notes, cautions, and warningsNOTE: A NOTE indicates important information that helps you make better use of your product.CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoidthe problem.WARNING: A WARNING indicates a potential for property damage, personal injury, or death. 2021 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Othertrademarks may be trademarks of their respective owners.
ContentsChapter 1: System overview. 5Key workloads. 5New technologies. 5Chapter 2: System features and generational comparison. 7Chapter 3: Chassis views and features. 8Chassis views.8Front view of the system.9Rear view of the system. 9Inside the system. 10Quick Resource Locator. 10Chapter 4: Processor.11Processor features . 11Supported processors.11Chapter 5: Memory subsystem.13Supported memory. 13Memory speed. 13Chapter 6: Storage. 15Storage controllers. 15Supported drives.15External Storage . 16Chapter 7: Networking. 17Overview. 17OCP 3.0 support . 17Supported OCP cards. 17Chapter 8: PCIe Subsystem. 18PCIe risers.18Riser 1A. 18Riser 1B. 19Riser 2B.20M.2 SATA Riser.20Chapter 9: Power, thermal, and acoustics. 22Power. 22Power Supply Subsystem .22Thermal. 24Thermal design. 24Contents3
Acoustics. 24Acoustical performance. 24Chapter 10: Rack, rails, and cable management. 27Rails information . 27Chapter 11: Supported Operating Systems. 29Chapter 12: Dell EMC OpenManage systems management. 30Server and Chassis Managers.31Dell EMC consoles. 31Automation Enablers. 31Integration with third-party consoles.31Connections for third-party consoles. 31Dell EMC Update Utilities.31Dell resources.31Chapter 13: Dell Technologies Services .33Dell EMC ProDeploy Enterprise Suite . 33Dell EMC ProDeploy Plus.34Dell EMC ProDeploy.34Basic Deployment. 34Dell EMC Server Configuration Services. 34Dell EMC Residency Services.34Dell EMC Remote Consulting Services. 34Dell EMC Data Migration Service. 34Dell EMC ProSupport Enterprise Suite. 34Dell EMC ProSupport Plus for Enterprise. 35Dell EMC ProSupport for Enterprise. 35Dell EMC ProSupport One for Data Center.36ProSupport for HPC. 36Support Technologies.37Dell Technologies Education Services.38Dell Technologies Consulting Services.38Dell EMC Managed Services. 38Chapter 14: Appendix A. Additional specifications. 39Chassis dimension. 39Chassis weight. 39Video specifications. 39Power supply specifications. 40Environmental specifications.44Chapter 15: Appendix B. Standards compliance. 45Chapter 16: Appendix C Additional resources.464Contents
1System overviewTopics: Key workloadsNew technologiesKey workloads Web scale applications/software as a service (SaaS)/infrastructure as a service (IaaS)High performance computing (HPC)Financial modeling and high frequency trading (HFT)Render nodes for visual effects rendering (VFX)Private cloud infrastructureHigh performance data analytics (HPDA)New technologiesThe following technologies are introduced or improved in the PowerEdge C6520.Table 1. New TechnologiesTechnologyDetailed DescriptionIntel processor product familyPlease refer the Processor section for specific SKU details. Ultra path interconnect (up to 11.2 GT/s) Peripheral controller hub (PCH): Intel C620 series chipset Core count (up to 40) Max TDP: 270 W Mismatched SKUs in a 2S configuration is not allowed.3200 MT/s DDR4 memorySelect SKUs of the Intel processors support 3200 MT/s memory.The PowerEdge C6520 supports one DIMM per channel at 3200MT/s with selected processors. Refer the Memory section foradditional speed/population details. 8 x DDR4 channels per socket, 1 DIMM per channel (1 DPC) Up to 3200 MT/s (configuration-dependent) RDIMMs up to 64 GB and LRDIMMs up to 128 GB supportedOCP 3.0 cardSupports standard OCP 3.0 connector with PCIe x16 bus.M.2 cardSupports chipset M.2 SSD solution with SATA interface.Form factor: 22 x 80 mmNVMe HDDSupports two type of NVMe backplane chassis. New 24 x 2.5-inch all NVMe backplane chassis (NVMe only, noSAS/SATA support) 24 x 2.5-inch SAS/SATA backplane chassis with up to 8 NVMedrives (six drives per sled with up to two NVMe drives per sled)iDRAC9 w/ Lifecycle ControllerEach PowerEdge C6520 compute node includes iDRAC9 consistentwith 15G behaviors. The embedded systems management solutionfor Dell servers features hardware and firmware update, inventorySystem overview5
Table 1. New Technologies (continued)TechnologyDetailed Descriptionand monitoring with in-depth memory alerting, faster performance,a dedicated gigabit port and many more features.6System overview
2System features and generationalcomparisonThe following table shows the comparison between the PowerEdge C6520 with the PowerEdge C6420.Table 2. Features compared to previous versionFeaturePowerEdge C6520PowerEdge C6420ChassisC6400 chassisC6400 chassisProcessorUp to two 3rd Generation Intel Xeon Processor Scalable familyUp to two 2nd Generation Intel Xeon Processor Scalable familyAir and direct contact liquid cooling.Air and direct contact liquid cooling.Configuration restrictions apply due tothermal or power limits.Configuration restrictions apply due tothermal or power limits.DDR4: 8 channels per processorDDR4: 6 channels per processorUp to 16x RDIMMs and LRDIMMsUp to 12x RDIMMs and LRDIMMSSpeed: up to 3200 MT/sSpeed: 2900 MT/sBackplanes: 24 x 2.5-inch (direct and NVMe withtwo universal slots) 24 x 2.5-inch all NVMe 12 x 3.5-inch No backplaneBackplanes: 24 x 2.5-inch (direct, expander andNVMe with two universal slots) 12 x 3.5-inch direct No-backplaneInternal: uSD card, M.2 SATA BOSS 1.5Internal: uSD card, M.2 SATA BOSS 1.0No support for persistent memoryNo support for persistent memoryHW RAID: PERC 10: H350, H345,HBA355i, HBA345, H750 and H745HW RAID: PERC 9 Mini (Mini H330,H730P, HBA330)Chipset: SATAChipset: SATASW RAID: Yes, S150SW RAID: Yes, S1402 PCIe Gen4 HH/HL slots, x16 (network,storage, AIC)1 PCIe Gen3 HH/HL slot, x161 OCP3 Gen4 slot x161 x16 OCP Slot (network)MemoryStorageStorage controllersI/O slots1 MEZZ slot x8 (storage),LOMSingle port 1 Gbe LOM (Broadcom)Single port 1 Gbe LOM (Intel)PSUSupport for 2 x 1600 W, 2000 W, 2400W, and 2600 WSupport for 2 x 1600 W, 2000 W, and2400 WSupport 1 1 with FTRSupport 1 1 with FTRSystems managementiDRAC9 with Lifecycle ControlleriDRAC9 with Lifecycle ControllerAcceleratorsAt least one GPU/FPGA/PAC (up to 75W)NACSILTier-1 CMT approved exceptioncountriesTier-1 CMT approved exceptioncountriesSystem features and generational comparison7
3Chassis views and featuresTopics: Chassis viewsChassis viewsThe PowerEdge C6400 chassis is a rack mount 2U chassis with static rails. It is leveraged from previous 14G generation andsome new highlights are: New chassis option - 24 x 2.5-inch NVMe backplane configuration (optimized for use cases demanding higher IOPS such ascache tier New higher wattage power supply – 2600 WThe table provides a summary of different chassis options that will be available.Table 3. PowerEdge C6400 available chassis optionsChassistypeDescriptionLiqui SASdcoolingSATASSDNVMeMin HDDMax HDDMaxNVMeDisklessNo backplaneYesN/AN/AN/AN/A00N/A2.5 inches 2.5 inches DirectSAS/SATA BackplaneYesYesYesYesN/A124N/A2.5 inchesSAS/SATA/NVMe2.5 inches NVMeBackplaneYesYesYesYesYes0*242 NVMedrives orsled2.5 inchesNVMeNew 2.5 inches All YesNVMe BackplaneNoNoYesYes1246 NVMedrives orsledYesYesYesN/A112N/A(No SAS/SATAsupport)3.5 inches3.5 inches DirectBackplaneYesNOTE: * If configured with on-board SATA controllerThe PowerEdge C6400 is a rack mount 2U chassis, it contains several elements: 8Chassis management board (CM Board)Power interposer board (PIB)Linking boardControl panel with LED/LED board (ear board)Mid-plane board24 x 2.5-inch SAS/SATA, with up to 8 x NVMe, or NVMe only12 x 3.5-inch SAS/SATADiskless, no backplaneThermal sensor boardPower supply units (PSU)FansChassis views and features
Front view of the systemFigure 1. Front view of the C6400 Chassis1. Left control panel2. 2.5 inches drive bay3. Right control panelRear view of the systemFigure 2. Rear view of the system1.2.3.4.5.6.7.1U half width compute sledPower SuppliesPCIe Gen4 x16 slotsOCP 3.0 Gen4 x16 slotMicro USB port for iDRAC DirectMini Display Port for video1 GbE (RJ45) port for systems mgmt. and/or hostChassis views and features9
Inside the systemFigure 3. Inside the system C6400Quick Resource LocatorFigure 4. Quick Resource Locator for C652010Chassis views and features
4ProcessorTopics: Processor featuresProcessor featuresThe 3 rd Generation Xeon Scalable Processors stack is next generation data center CPU offering with the latest features,increased performance, and incremental memory options. This latest generation Xeon Scalable processor will support usagesfrom entry designs based on Intel Xeon Silver processors to advanced capabilities offered in new Intel Xeon Platinum processor.The following lists the features and functions included in the upcoming 3 rd Generation Intel Xeon Scalable Processor offering: Faster UPI with 3 Intel Ultra Path Interconnect (Intel UPI) at 11.2 GT/s (supported in gold and platinum options) More, Faster I/O with PCI Express 4 and up to 64 lanes (per socket) at 16 GT/s Enhanced Memory Performance with support for up to 3200 MT/s DIMMs (2 DPC) Increased Memory Capacity with up to 8 channels and up to 256 GB DDR4 DIMM supportSupported processorsTable 4. CPU BIN StackProcessorFrequency (GHz)Cores/ThreadsCache (MB)Max Memory Turbospeed (MT/s)TDP 2/64482667Yes1856330228/56423200Yes205Processor11
Table 4. CPU BIN Stack (continued)ProcessorFrequency (GHz)Cores/ThreadsCache (MB)Max Memory Turbospeed (MT/s)TDP /16122666Yes10512Processor
5Memory subsystemThe PowerEdge C6520 supports up to 16 DIMMs in a 2S configuration, with up to 2 TB of memory capacity and speeds of up to3200 MT/s. The PowerEdge C6520 has eight DIMM channels per processor with one DIMM per channel (DPC).The PowerEdge C6520 supports 16 GB/32 GB/64 GB (registered) RDIMMs. It supports 128 GB LRDIMMs and it will notsupport UDIMMs or persistent memory.Topics: Supported memoryMemory speedSupported memoryThe table below lists the memory technologies supported by the platform.Table 5. Supported memory typeFeaturePowerEdge C6520 (DDR4)DIMM typeRDIMMLRDIMMTransfer speed3200 MT/sVoltage1.2 V (DDR4)The table below lists the supported DIMMs for the platform at launch. For information on memory configuration, see the DellEMC PowerEdge C6520 Installation and Service Manual at www.dell.com/poweredgemanuals.Table 6. Supported DIMMsDIMM speedDIMM typeDIMM capacity(GB)Ranks perDIMMData widthDensityTechnology3200RDIMM162R88 GBSDP3200RDIMM322R48 GBSDP3200RDIMM642R416 GBSDP3200LRDIMM1284R416 GB3DS-2HMemory speedThe number of DIMMs per channel (DPC) does affect the operating memory bus speeds. Below is a table identifying the busspeeds for Intel Xeon Scalable processors:Table 7. DIMM performance detailsDIMM typeDIMM rankingCapacityDIMM rated voltage,speed1 DPCRDIMM1R8 GBDDR4 (1.2 V), 3200D:3200RDIMM2R16 GB, 32 GB, 64 GBDDR4 (1.2 V), 3200D:3200Memory subsystem13
Table 7. DIMM performance details (continued)DIMM typeDIMM rankingCapacityDIMM rated voltage,speed1 DPCLRDIMM4R128 GBDDR4 (1.2 V), 3200D:320014Memory subsystem
6StorageTopics: Storage controllersSupported drivesExternal StorageStorage controllersTable 8. PERC series controller offeringsPerformance LevelController & DescriptionEntry LevelS150 (SATA, NVMe)SW RAID SATA, NVMeValueH350, H345, HBA355i, HBA345Value PerformanceH750, H745Supported drivesThe table shown below lists the internal drives supported by the PowerEdge C6520.Table 9. Supported drivesForm factorTypeSpeedRotational speedCapacities2.5 inchesSATA6 GBSSD120 GB, 200 GB, 240GB, 400 GB, 480 GB,800 GB, 960 GB, 1.6TB, 1.92 TB, 3.84 TB,7.68 TB2.5 inchesSATA6 GB7.2K1 TB, 2 TB2.5 inchesSAS12 GB7.2K2 TB2.5 inchesSAS12 GBSSD400 GB, 480 GB, 800GB, 960 GB, 1.6 TB,1.92 TB, 3.2 TB, 3.84TB, 6.4 TB, 7.68 TB,12.8 TB2.5 inchesSAS12 GB10K600 GB, 1.2 TB, 2.4 TB2.5 inchesSAS12 GB15K300 GB, 600 GB, 900GBM.2SATA6 GBSSD240 GB, 380 GBU.2NVMeNASSD960 GB, 1.6 TB, 1.92TB, 3.2 TB, 3.84 TB,Storage15
Table 9. Supported drives (continued)Form factorTypeSpeedRotational speedCapacities6.4 TB, 7.68 TB, 12.8TBuSDNAExternal StorageThe C6520 does not support any external storage.16StorageNAuSD16 GB, 32 GB, 64 GB
7NetworkingTopics: OverviewOCP 3.0 supportOverviewPowerEdge offers a wide variety of options to get information moving to and from our servers. Industry best technologies arechosen, and systems management features are added by our partners to firmware to tie in with iDRAC and Lifecycle Controller.These adapters are rigorously validated for worry-free, fully supported use in our servers.OCP 3.0 supportSupported OCP cardsOCP NIC 3.0 vs. Rack Network Daughter Card comparisonsTable 10. OCP 3.0, 2.0, and rNDC NIC ComparisonForm FactorDell rNDCOCP 2.0 (LOM Mezz) OCP 3.0NotePCIe GenGen 3Gen 3Gen 4Supported OCP3 areSFF (small form factor)Max PCIe Lanesx8Up to x16Up to x16See server slot specShared LOMYesYesYesThis is iDRAC portredirectAux PowerYesYesYesUsed for Shared LOMNetworking17
8PCIe SubsystemTopics: PCIe risersPCIe risersRiser 1AMajor components: Standard PCIe x16 connector, PCIe x16 source from processor 1. GL3224-OYI04 USB3.0 SD 3.0 Single LUN Memory Card Reader Controller. Supported MicroSD card capacities at RTS – 16GB, 32 GB, and 64 GB. RSPI – This part is used during service operations in the field. When replaced by new sled, the PCIe riser move from old sledto new sled. Lifecycle controller has easy-restore feature that can restore the new sled to same configuration and firmwarestate as old sled. This operation also includes personality module used for liquid cooling. System API (SAPI) – The core of the Riser SAPI consists of the Silicon Labs EFM8BB1 micro controller, and the MCU willperiodically transmits pertinent riser data over a 1-wire UART to the host system (CPLD and BIOS). The payload between riser MCU and host system includes two information: One is fixed riser information which is determined using a table structure that can be read through two MCU’s ADCpin. Meanwhile, it is pre-programmed into the MCU code base. (e.g. riser type, slot width, slot source lanes, etc.). The other is dynamic riser information which can be read in through the MCU’s GPIO pins and serialized down to thehost system. (e.g. adapter presence detect, WAKE#, etc.)GL3224 and EFM8BB1 features: Support USB mass storage class bulk-only transport (BOT)Super speed USB or USB 2.0 transceiver macro (UTM), serial interface engine (SIE), and embedded power-on reset (POR)Support secure digital v1.0 / v1.1 / v2.0/ SDHC / SDXC (capacity up to 2 TB)Support serial peripheral interface (SPI) for firmware upgrade to SPI flash memory via USB interfaceRiser 1A dimensionBoard Size: 126.30x31.42 mm, 8 Layers18PCIe Subsystem
Figure 5. Riser 1A dimensionRiser 1BMajor components: Standard PCIe x16 connector, PCIe x16 source from processor 1 x8 and x8 from processor 2 by cable. RSPI - This part is used during service operations in the field. When replaced by new sled, the PCIe riser move from old sledto new sled. Lifecycle controller has easy-restore feature that can restore the new sled to same configuration and firmwarestate as old sled. This operation also includes personality module used for liquid cooling. System API (SAPI) – The core of the riser SAPI consists of the Silicon Labs EFM8BB1 microcontroller, and the MCU willperiodically transmits pertinent riser data over a 1-wire UART to the host system (CPLD and BIOS). The payload between riser MCU and host system includes two information: One is fixed riser information which is determined using a table structure that can be read through two MCU’s ADCpin. Meanwhile, it is pre-programmed into the MCU code base. (e.g. riser type, slot width, slot source lanes, etc.) The other is dynamic riser information which can be read in through the MCU’s GPIO pins and serialized down to thehost system. (e.g. adapter presence detection, WAKE#, etc.)Riser 1B dimensionBoard size: 144.38 x 31.45 mm, 8 layersFigure 6. Riser 1B dimensionPCIe Subsystem19
Riser 2BMajor components: Standard PCIe x16 connector, PCIe x16 source from processor 1. System API (SAPI) – The core of the riser SAPI consists of the Silicon Labs EFM8BB1 micro controller, and the MCU willperiodically transmits pertinent riser data over a 1-wire UART to the host system (CPLD and BIOS). The payload between riser MCU and host system includes two information: One is fixed riser information which is determined using a table structure that can be read through two MCU’s ADCpin. Meanwhile, it is pre-programmed into the MCU code base. (e.g. riser type, slot width, slot source lanes, etc.) The other is dynamic riser information which can be read in through the MCU’s GPIO pins and serialized down to thehost system. (e.g. adapter presence detection, WAKE#, etc.)Riser 2B dimensionBoard size: 158.73 x 29.35 mm, 10 layersFigure 7. Riser 2B dimensionM.2 SATA RiserThe M.2 x16 Mezz SATA Riser can connect M.2 x16 module to J M2 of main board. Only SATA0 port will be supported forinternal boot purpose.PCB Dimension:20PCIe Subsystem
Figure 8. M.2 X 16 SATA Riser PCB DimensionTable 11. PCIe Riser Slot CPU Orientation MatrixExpansion Slots MappingRiserSlot #Form FactorControlling CPUSlot’s ElectricalBandwidth /PhysicalConnectorPower———CPUPCIe Gen4 x 16(through Riser 1A)75WLP PCIeSlot(SLOT1)1Low profileCPU1/2PCIe Gen4 x8 fromCPU1, x8 fromCPU2 (throughRiser 1B to supportSNAPI card)25WLP PCIeSlot(SLOT2)2Low profileCPU1PCIe Gen4 x16(through Riser 2B)75WOCP SlotINTLow profileCPU1PCIe Gen4 x 1680WM.2 BOSSslot3ProprietaryCPU2PCIe Gen4 x 1625WPCIe Subsystem21
9Power, thermal, and acousticsPowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps regulatetemperature thereby reducing server noise and power consumption. The table below lists the tools and technologies Dell offersto lower power consumption and increase energy efficiency.Topics: PowerThermalAcousticsPowerPlease refer to the “Power Supply Subsystem” topic.Power Supply SubsystemPower Supply Options OverviewEnergy Smart power supplies have intelligent features, such as the ability to dynamically optimize efficiency while maintainingavailability and redundancy. Also featured are enhanced power- consumption reduction technologies, such as high- efficiencypower conversion and advanced thermal- management techniques, and embedded power- management features, including highaccuracy power monitoring.For C6400 chassis, the power supply subsystem is formed with two AC-DC redundant power supplies. The power supplyprovides 12V and 12Vaux for redundant design. There are several voltage regulators in the system to supply different voltagelevels needed by different logic devices.NOTE: Unlike C6300 chassis where PSUs are resident on the left side of the chassis, C6400 chassis has PSUs in thecenter. Customers need to note this change to plan power
This latest generation Xeon Scalable processor will support usages from entry designs based on Intel Xeon Silver processors to advanced capabilities offered in new Intel Xeon Platinum processor. The following lists the features and functions included in the upcoming 3. rd. Generation Intel Xeon Scalable Processor offering:
