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--AZ-GLBAA-MNx X:::::::' !*QjKX.)OOCX)C X:::::::·: :IIIIIIIIIIIII : ;IIUUIUIII : ;MicroVAX II630Q8Technical ManualPrepared by Educational Servicesof Digital Equipment Corporation
1st Edition, November 1985 Digital Equipment Corporation 1985.All Rights Reserved.The material in this manual is for informational purposes and is subject to changewithout notice.Digital Equipment Corporation assumes no responsibility for any errors that mayappear in this manual.FCC Notice: This equipment generates, uses, and may emit radio frequencyenergy. The equipment has heen tested and found to comply with the limits for aClass A computing device pursuant to Subpart J of Part 15 of FCC Rules, whichare designed to provide reasonable protection against such radio frequency interference when operated in a commercial environment. Operation of this equipment in aresidential area may cause interference, in which case the user, at his ownexpense, may be required to take measures to correct the interference.Printed in U.S.A.The manuscript for this book was created on a VAX-1l/780 system and, via atranslation program, was automatically typeset by Digital's DECset Integrated Publishing System. The book was produced by Educational Services Development andPublishing in Marlboro, MA.The following are trademarks of Digital Equipment Corporation:mamaDma STSRSXRTULTRIX-32mUNIBUSVAXVAXELNVMSVTWork Processor
ContentsIntroductionChapter 1BA123-A Enclosure1.11.21.31.3.11.3.21.51.61.7INTRODUCTION .ENCLOSURE FRAME .CONTROL PANEL .Mass Storage Shelves .CPU Console Board. . . . . . . . . . . . . . .SIGNAL DISTRIBUTION BOARD .BACKPLANE .POWER SUPPLy .I/O DISTRIBUTION PANEL .Chapter 2Base System2.12.22.2.12.2.22.2.32.3INTRODUCTION .KA630-A CPU .Console Program .Primary Bootstrap Program (VMB) .CPU Patch Panel Insert .MS630 MEMORY MODULE .Chapter 3System Options3.13.1.13.1.23.23.2.13.2.2INTRODUCTION .Ordering Options.Module Configuration .COMMUNICATIONS .DEQNA Ethernet Interface .DHVll Asynchronous Multiplexer (Eight Lines) -93-13-13-23-43-43-6iii
.33.3.13.3.23.3.2.13.3.2.23.3.33.43.4.1DHV11 Remote Distribution Cabinet Kit(CK-DHV11-VA) . 3-9DLVJ1 Asynchronous Interface (Four Lines) . 3-11DMV11 Synchronous Controller . 3-14DPV11 Synchronous Interface . 3-20DRV11-J High Density Parallel Interface (Four Lines) . 3-24DZQ11 Asynchronous Multiplexer (Four Lines) . 3-26DZV11 Asynchronous Multiplexer (Eight Lines) . 3-29LPV11 Interface Module (For LP25 System Printer) . 3-32DISK STORAGE . 3-34RQDX2, RQDX3 Disk Controllers . 3-34RD52, RD53 Disk Drives . 3-37Factory Configuration . 3-37Disk Formatting . 3-37RX50 Diskette Drive . 3-39TAPE STORAGE . 3-40TK50 Tape Drive Subsystem . 3-40Chapter 44.1.54.2CONFIGURATION RULES .Module Physical Priority .Expansion Space .Backplane .1/0 Distribution Panel Insert Space.Power Requirement .Bus Loads .Module CSR Addresses and Interrupt Vectors .CONFIGURATION EXAMPLES .Chapter 5Diagnostics5.15.25.2.15.2.25.2.35.3INTRODUCTION .KA630-A BOOT AND DIAGNOSTIC ROM .Power-up Mode .Console Mode .Console Terminal Error Messages .POWER-UP LEDS ON MASS STORAGE, BACKUP,AND COMMUNICATIONS DEVICES .MicroVAX MAINTENANCE SySTEM .Test the System (Menu Item #1) 5-55-75-105-12
Contents5.5.2Display System Configuration and Devices(Menu Item #2) .Display the Utilities Menu (Menu Item #3) .Display the Service Menu (Menu Item #4) .Exit the MicroVAX Maintenance System(Menu Item #5) .TROUBLESHOOTING.Unknown System Level Problems(System Fails to Boot) .Device-Specific Problems .Chapter 6FRU Removal and Replacement 6.16.6.26.76.86.96.106.116.12INTRODUCTION . 6-1REMOVAL OF THE EXTERIOR PANELS . 6-4Removal of the Right Side Panel. . 6-4Removal of the Left Side Panel. . 6-6ON/OFF SWITCH REMOVAL. 6-8CPU CONSOLE BOARD REMOVAL . 6-913.3 cm (5.25 in) MASS STORAGE DEVICE REMOVAL . 6-10RD52 Read/Write Board Removal. . 6-10RD53 ReadfWrite Board Removal. . 6-14FAN REMOVAL . 6-16Mass Storage Fan Removal . 6-16Card-Cage Fan Removal . 6-18MODULE REMOVAL . 6-19DOOR INTERLOCK SWITCH REMOVAL . 6-21TEMPERATURE SENSOR REMOVAL . 6-21POWER SUPPLY REMOVAL . 6-23BACKPLANE REMOVAL . 6-25FILTER CONNECTOR REMOVAL . 135-135-13AppendixesAppendix AAppendix BConsole Commands . A-IConsole Error Messages and Explanations . B-1v
viBAI23-A Enclosure . 1-1BAI23-A Removable Panels and Doors . 1-2Air Flow . 1-3Temperature Sensor PC Board . 1-4Mass Storage Shelves . 1-5CPU Console Board . 1-7Signal Distribution Board. 1-8Signal Distribution Board Cabling . 1-9Backplane Grant Continuity. 1-11Backplane Connectors . 1-12Power Supply . 1-14Circuit Breaker, Voltage Select Switch, Connectors (Rear View) . 1-15Electrical Distribution . 1-16I/O Distribution Panel. . 1-18Filter Connectors and Adapter Plate . 1-19KA630-A CPU Module . 2-3CPU Patch Panel Insert (Front View) . 2-6CPU Patch Panel Insert (Rear View) . 2-7DEQNA Module Layout. . 3-4DEQNA Internal Cabling . 3-5DHVll Module Layout . 3-7DHVll Internal Cabling . 3-8DHVll Remote Distribution Cabinet Kit. . 3-10DLVJl Module Layout. 3-12DLVJl Internal Cabling . 3-13DMVll (M8053) Module Layout. . 3-17DMVll (M8064) Module Layout. . 3-17M8053 Internal Cabling. 3-18M8064 Internal Cabling. 3-19DPVll Module Layout . 3-20DPVll Internal Cabling . 3-23DRVII-J Module Layout . 3-24DRVII-J Internal Cabling . 3-25DZQll Module Layout . 3-26DZQll Internal Cabling . 3-28DZVll Module Layout . 3-29DZVll Internal Cabling . 3-31LPVll Module Layout . 3-32LPVll Internal Cabling . 3-33
-96-106-116-126-136-146-156-166-176-186-19RQDX2 Module Layout . 3-35RQDX3 Module Layout . 3-35RD52 Disk Drive and Shunt Jumper . 3-38RX50 Diskette Drive . 3-39TK50 Tape Drive Subsystem . 3-40M7546 Module Layout . 3-41Configuration Worksheet . 4-4Module Utilizations . 4-9Base System . 4-11Advanced System . 4-12KA630-A CPU Module LEDs . 5-5Example of a Console Terminal Error Message . 5-6LED Orientation on the DEQNA Module . 5-7LED Orientation on the RQDX2 Module . 5-7LED Orientation on the TQK50 Module . 5-9Disclaimer Screen . 5-10Load Additional Media Screen . 5-11Maintenance System Main Menu . 5-11Troubleshooting Flowchart for Fail-to-Boot Problems . 5-14Troubleshooting Flowchart for Device-Specific Problems . 5-15BA123-A FRUs . 6-3Unhooking the Right Side PaneL . 6-4Removing the Right Side Pane!. . 6-5Unhooking the Left Side PaneL. 6-6Removing the Left Side Pane!. . 6-7On/Off Switch Removal . 6-8CPU Console Board Removal . 6-9Removing the Slide Plate . 6-11Removing the 2-Pin Connector and Screws . 6-11Removing the Front Bezel. 6-12Removing Phillips Screws from Heatsink . 6-13Removing the MPCB . 6-13RD53 Read/Write Board RemovaL . 6-15Mass Storage Fan Removal. . 6-17Card-Cage Fan Removal . 6-18Module Removal . 6-20Door Interlock Switch/Temperature Sensor . 6-22Power Supply Removal . 6-24Backplane Removal . 6-26vii
13-223-234-14-24-35-15-25-35-46-1B-1viiiRegulator A and B Current and Power . 1-13Cutout and Insert Panel Sizes . 1-17Console Program Boot Sequence . 2-5MS630 Memory Module Versions . 2-9DEQNA CSR Address and Interrupt Vector . 3-5DHV11 CSR Address . 3-7DHVll Interrupt Vector . 3-7DLVJ1 CSR Address . 3-11DL VJ1 Interrupt Vector . 3-12DMV11 Versions . 3-14DMV11 Interfaces . 3-14DMV11 CSR Address . 3-15DMV11 Interrupt Vector . 3-15DMVll Switch Selectable Settings . 3-16DPVll CSR Address . 3-21DPV11 Interrupt Vector . 3-21DRV11-J CSR Address . 3-25DZQ11 CSR Address . 3-27DZQll Interrupt Vector . 3-27DZVl1 CSR Address . 3-30DZV11 Interrupt Vector . 3-30LPV11 CSR Address . 3-32LPV11 Interrupt Vector . 3-33RQDX2/RQDX3 CSR Address . 3-36Revision Level Switch Settings . 3-41Unit Number Settings . 3-42M7546 Controller Module CSR Address . 3-42Power Requirements, Bus Loads, I/O Inserts . 4-5Address/Vector Worksheet . 4-7Floating CSR Addresses . 4-8LED Status and Countdown Error Messages . 5-2DEQNA Module LED Indications . 5-7RQDX2 Module LED Indications . 5-8TQK50 Module LED Indications . 5-9BA123-A FRUs . 6-1Console Error Messages and Explanations . B-1
IntroductionThis manual describes the MicroVAX II 630QB system. Housed in the BA123-Aenclosure, this system uses standard Q22-Bus options and mass storage devices.Chapter 1 describes the BA123-A enclosure, including the backplane, power supply,mass storage area, I/O distribution panel, and internal cabling.Chapter 2 describes the MicroVAX II KA630-A CPU module, the CPU patch panelinsert, and MS630 memory module.Chapter 3 describes the communications, mass storage, and backup devices currently available as system options. The chapter provides configuration tables, cabinet kit information, and a brief description of each device.Chapter 4 provides configuration information required for system expansion. Examples of typical systems are shown.Chapter 5 describes the MicroVAX II power-up self-test and corresponding countdown error messages. The customer version of the Micro VAX Maintenance Systemand basic troubleshooting are also covered.Chapter 6 lists the field replaceable units (FRUs) and provides appropriate removaland replacement procedures.Appendix A provides information on MicroVAX II console commands.Appendix B lists the console error messages produced by the KA630-A CPU, alongwith a brief explanation of each message.CONVENTIONSLower case n represents multiple numbers, where a specific designation is unnecessary or cumbersome (for example, RD5n instead of RD51, RD52, RD53). Similarly, a lowercase x represents multiple letters.ix
IntroductionNOTES, CAUTIONS, AND WARNINGSNotes, cautions, and warnings appear throughout this manual and are defined asfollows. A note contains general information. A caution contains information toprevent damage to equipment. A warning contains information to prevent personalinjury.RELATED DOCUMENTSThe following is a list of related documents for the MicroVAX II systems.KA630-A CPU Module User's GuideMicro VAX System Maintenance GuideDEQNA Ethernet User's GuideDHVll Technical ManualDLVll-J User's GuideDMVll Synchronous Controller Technical ManualDPVll Synchronous Interface User's ManualDRVll-J Interface User's ManualDZVll Asynchronous Multiplexer Technical ManualRDS2-D, -R Fixed Disk Drive Subsystem Owner's ManualRDS3-D, -R Fixed Disk Drive Subsystem Owner's ManualRQDX2 Controller Module User's GuideRQDX3 Controller Module User's GuideRXSO-AA Diskette Drive Subsystem Owner's ManualTKSO Tape Drive Subsystem User's GuideYou can order these documents from:Digital Equipment CorporationAccessories and Supplies GroupP.O. Box CS2008Nashua, NH 03061Attention: Documentation UGEK-RX50A-MMEK-LEP05-0M
BA123-A Enclosure1.11INTRODUCTIONThe BAI23-A enclosure (Figure 1-1) is a floor stand unit for microcomputer systems. It can support a wide variety of hardware options. The air-cooled enclosureis designed to operate in an open office environment. It includes the followingmajor components: Enclosure frame Backplane assembly Control panel Power supply Mass storage area I/O distribution panelFigure 1-1BAI23-A Enclosure1-1
SA 123-A Enclosure1.2 ENCLOSURE FRAMEThe BA123-A enclosure frame houses the power supply and the backplane assembly. It also provides mounting space for five 13.3 cm (5.25 in) mass storagedevices. It is mounted on four shock-isolating casters and has the followingdimensions:Height: 62.2 em (24.5 in)Width: 33.0 em (13.0 in)Depth: 70.0 em (27.5 in)The enclosure frame is covered by removable panels on the front, right, and leftsides (Figure 1-2).There are three doors: a control panel door on the front, an I/O panel door at therear, and a card-cage door inside the right side panel.NOTEFor panel removal procedures, see Section 6.2.MR-14028Figure 1-2 BA123-A Removable Panels and Doors1-2
BA 123-A EnclosureThree fans in the BA123-A enclosure draw air into the top of the enclosure fromthe following areas (Figure 1-3): Below the module card cage Behind the control panel Inside the power supplyFigure 1-3 Air Flow1-3
SA 123-A EnclosureA printed circuit (PC) board above the card cage contains two temperature sensors(Figure 1-4). One sensor regulates the speed of the card-cage fan, keeping it at theminimum level required to maintain a constant temperature within the card cage.The other sensor shuts down the system at high temperature. The card-cage doorencloses the area surrounding the modules. Removal of this door triggers an interlock switch, which increases the speed of the card-cage fan to maximum. If theproper temperature within the card cage cannot be maintained, even at maximumfan speed, the over-temperature sensor causes the system to shut down. The system also shuts down if the card-cage fan fails.Figure 1-4 Temperature Sensor PC Board1-4
BA 123-A Enclosure1.3 CONTROL PANELThe control panel has six cutouts to provide space for control circuits. One cutoutis used for a CPU console board. The other five cutouts provide space for massstorage console boards. Unused cutouts are covered with removable plates. Figure1-5 shows the relationship between the cutouts and the mass storage shelves.LEGEND:1. DISK DRIVE 12. DISK DRIVE 23. DISK DRIVE 34. TAPE DRIVE5. DISKETTE DRIVEFigure 1-5 Mass Storage Shelves1.3.1Mass Storage ShelvesThe front panel covers five shelves used for mounting 13.3 cm (5.25 in) massstorage devices (Figure 1-5) The maximum recommended number of mass storagedevices is four. These should be installed with two in shelves 1 and 2 and two inshelves 3, 4 or 5. Removable plates in front of shelves 3, 4 and 5 allow access toremovable mass storage devices.1-5
BA 123-A Enclosure1.3.2CPU Console BoardThe CPU console board (Figure 1-6) is attached to the back of the control panel. Itcontains a DC OK indicator light, and two buttons that allow the user to halt orrestart the system. A ribbon cable connects the CPU console board to the backplane. This cable provides the connection between the CPU and the CPU consoleboard. The buttons and DC OK light provide the following functions: When the Halt button is depressed, the red LED in the Halt button lights. Thesystem then enters console I/O mode (Section 2.2.1), providing halts are enabledby the switch on the CPU distribution panel at the rear of the system (Section2.2.3).NOTEIf halts are disabled at the rear of the system, the LED in theHalt button still lights when the button is depressed, but thesystem is not halted. When the DC OK light is ON, the system is receiving stable dc voltage from thepower supply. When the Restart button is depressed, the system boots.There are two LEDs on the CPU console board. These can be seen by removingthe left side panel of the enclosure. If the DC OK light on the control panel is notlit, these two LEDs indicate which regulator supply to the backplane has failed:Left LED:Right LED:1-6Regulator ARegulator B
BA 123-A EnclosureWhen a LED is ON, 5 Vdc to the backplane is OK. When the LEDs are OFF, aregulator or connection to a regulator has failed.NOTEThere should be at least one module in both odd- and evennumbered backplane slots to draw enough current to start eachregulator. See Section 1.6.There is a DIP switch pack to the left of the LEDs that contains two switches.Both switches are normally OFF and are unused in Micro VAX II systems.RESTART/RUNDC OKHALTLEDIREGULATOR A)LEDIREGULATOR 8)MR-14187Figure 1-6 CPU Console Board1-7
SA 123-A Enclosure1.4 SIGNAL DISTRIBUTION BOARDThe signal distribution board (M9058, Figure 1-7) is mounted in the bottom two(C and D) rows of backplane slot 13.Up to four fixed disk drives, or an RX50 diskette drive and up to two fixed diskdrives, can be connected to the signal distribution board (Figure 1-8). The signaldistribution board is connected by a 50-conductor ribbon cable to an RQDXn massstorage controller module in the card cage. The signal distribution board is alsoconnected to the RD console boards behind the control panel by a 40-conductorribbon cable.@@@MM-14032Figure 1-7 Signal Distribution Board1-8
17·00867·0117·00862·01OJ».NOTE: ROOX2 AND RD52 ARE SHOWN. RODX3AND/OR RD53 MAY ALSO BE USED.MR-14033 :l Figure 1-8 Signal Distribution Board Cablingm::J()0"enc bCD
SA 123-A Enclosure1.5BACKPLANEThe BA123-A has a 4-row by 13-slot backplane that measures 27.9 X 19.9 cm(11 X 7.85 in). The backplane implements the extended LSI-11 bus (or Q22-Bus),which uses 22-bit addressing.The first 12 slots of the backplane provide space for dual- or quad-height modulesthat are compatible with the Q22-Bus. A dual-height module has connectors that fit into two rows of a backplane slot.Two dual-height modules can occupy one backplane slot.NOTEDual-height modules in slots 5-11 and rows C and D of slot 12require another dual-height module or an M9047 grant card inthe other two rows of the slot. A quad-height module has connectors that fit into all four rows of a backplaneslot. One quad-height module occupies one backplane slot.Figure 1-9 shows the grant lines for the Q22-Bus interrupt and for direct memoryaccess (DMA). The C and D rows of slots 1-4 implement a separate MicroVAX IIlocal memory interconnect that is used to interlace the system CPU and memorymodules.1-10
BA 123-A EnclosureFRONT OFSYSTEM1312111098SLOTS76543REAR OFSYSTEM2ABRowScoMA-14068Figure 1-9 Backplane Grant ContinuityFour 120 ohm resistor packs between backplane slots 12 and 13 are used toterminate the Q22-Bus. The thirteenth slot of the backplane provides space for twodual-height modules (rows AB and CD). The Q22-Bus is not implemented in thisslot. The CD rows are used for the signal distribution board. The AB rows can beused for a second signal distribution board. The thirteenth slot provides 5 Vdc, 12 Vdc, ground, and a signal (DC OK) that indicates dc voltage from the powersupply is stable.NOTEThis backplane is a "bounded" system. That is, additional backplanes cannot be connected to the system.1-11
BA 123-A EnclosureThe backplane supports a maximum of 38 ac loads and 20 dc loads The backplanebalances the load on each of the power supply's two regulators. Figure 1-10 showsthree 1 connectors on the backplane. 11 and 12 are 18-pin connectors that receive dc power and sign
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