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CNC Video Measuring SystemsISO/IEC 17025 CertifiedNikon Corporation Instruments Company has been certified as an ISO/IEC 17025 accredited calibration laboratory for CNC Video measuring systems by the JapanAccreditation Board for Conformity Assessment.(ISO/IEC 17025: International standard, which specifies the general requirements to ensure that a laboratory is competent to carry out specific tests and/or calibrations)Destined to Improve QualityDate of accreditation:Accredited section:November 22, 2010Accredited section: Industrial Instruments CS 1st Engineering Section,Quality Assurance Department, Instruments CompanyCalibration site:Customer’s laboratory (field service)Type of measuring instruments: Coordinate measuring machineMaximum measuring abilities (K 2)[L measurement length (mm)]Scope of calibrationInterval distance measurementL 420mm420 L 1000mm0.34µm(0.45 0.54 x L/1000)μmThe NEXIV VMR SeriesSpecifications and equipment are subject to change without any notice or obligationon the part of the manufacturer. May 2012 2005-12 NIKON CORPORATIONWARNINGTO ENSURE CORRECT USAGE, READ THE CORRESPONDINGMANUALS CAREFULLY BEFORE USING YOUR EQUIPMENT.N.B. Export of the products* in this catalog is controlled under the Japanese Foreign Exchange and Foreign Trade Law.Appropriate export procedure shall be required in case of export from Japan.* Products: Hardware and its technical information (including software) Monitor images are simulated. Company names and product names appearing in this brochure are their registered trademarks or trademarks.NIKON CORPORATIONShin-Yurakucho Bldg., 12-1, Yurakucho 1-chome, Chiyoda-ku, Tokyo 100-8331, Japanphone: 81-3-3216-2384 fax: ON METROLOGY, INC.NIKON SINGAPORE PTE LTDNIKON METROLOGY UK LTD.12701 Grand River Avenue, Brighton, MI 48116 U.S.A.phone: 1-810-220-4360 fax: 1-810-220-4300E-mail: sales http://www.nikoninstruments.com/SINGAPORE phone: 65-6559-3618 fax: 65-6559-3668UNITED KINGDOM phone: 44-1332-811-349 fax: 44-1332-639-881E-mail: sales [email protected] METROLOGY EUROPE NVKOREA phone: 82-2-2186-8400 fax: 82-2-555-4415Geldenaaksebaan 329, 3001 Leuven, Belgiumphone: 32-16-74-01-00 fax: 32-16-74-01-03E-mail: sales .com/NIKON INDIA PRIVATE LIMITEDNIKON INSTRUMENTS (SHANGHAI) CO., LTD.CANADA phone: 1-905-602-9676 fax: 1-905-602-9953CHINA phone: 86-21-6841-2050 fax: 86-21-6841-2060(Beijing branch) phone: 86-10-5831-2028 fax: 86-10-5831-2026(Guangzhou branch) phone: 86-20-3882-0552 fax: 86-20-3882-0580NIKON INSTRUMENTS S.p.A.NIKON MALAYSIA SDN BHDMALAYSIA phone: 60-3-7809-3688 fax: 60-3-7809-3633NIKON METROLOGY SARLNIKON INSTRUMENTS KOREA CO., LTD.FRANCE phone: 33-1-60-86-09-76 fax: 33-1-60-86-57-35E-mail: sales [email protected] phone: 91-124-4688500 fax: 91-124-4688527NIKON METROLOGY GMBHGERMANY phone: 49-6023-91733-0 fax: 49-6023-91733-229E-mail: sales [email protected] CANADA INC.ITALY phone: 39-055-300-96-01 fax: 39-055-30-09-93NIKON AGSWITZERLAND phone: 41-43-277-28-67 fax: 41-43-277-28-61NIKON GMBH AUSTRIAAUSTRIA phone: 43-1-972-6111-00 fax: 43-1-972-6111-40NIKON BELUXBELGIUM phone: 32-2-705-56-65 fax: 32-2-726-66-45Printed in Japan (1205-02)TCode No. 2CE-IWTH-5This brochure is printed on recycled paper made from 40% used material.En

The perfect answer to all your measurement needsThe NEXIV VMR series.With an expanded lineup that includes small to ultra-wide measurement platformsas well as versatility in optical head selection,the NEXIV VMR series provides complete support for all your measurement needs.NEXIV VMR EZ Solution FinderAppropriate Object Size(for FOV measurement athighest magnification)1*–5 µmVMR-1515VMR Maximum MagnificationModule Model Z120XVMR-3020VMR-6555Type 3Medical DevicesDies & Molds8*–40 µmVMR-10080VMR-12072LCD-Array ProcessProbe CardsHigh Density & MiniatureMachined PartsMEMSAdvanced Packaging Technology:Water Level CSP, FlipchipFlat Panel Display DevicesElectronic Devices:SMD/Connector/FerruleMicro Drills/EndmillsType 2Higher MagnificationOLED/LCD-Cell ProcessVMR-H3030Yes (Limited Use)Metrology LaboratoryModule ProcessPrinted Circuit Boards, Mask PatternMaster MachineYesHigh Precision EtchingProductLarge Size, Multiple Parts MeasurementYesLarger Measurement EnvelopeVersatile Measurement TasksColor CameraUltimate PrecisionSuper Zoom & High Accuracy Non-Contact Height MeasurementSemiconductor Packaging/Final Assembly Process4*–20 µmOptional PartsModelOptical HeadHigh Precision Dies & MoldsLead Frame Solar Cell ModulesMachined, Cast, Stamped, Etched, & Molded Parts16*–80 µmType 1YesAppropriate Wafer SizeAppropriate Display Panel SizeModel LU150mm (6 inch) wafers200mm (8 inch) wafers22 in.37 in.47 in.*For clear edges such as metallized line patterns on a transparent glass.Optional PartsStandard ProvidedSoftwareOptional SoftwareRotary Indexer RI-3600L(for Type 1 to 3)YesYesYesNoOnline CAD InterfaceVMR AutoMeasure / VMR CAD ReaderOffline CAD InterfaceVMR Virtual AutoMeasure2D Profile AnalysisVMR ProfilerHard / Software ControlVMR Control ProgramMultiple Language SupportEnglish / Japanese / Mandarin Chinese / Traditional Chinese / German / French, etc.Data File ManagementVMR Data ManagerQuick Data ReportingVMR Report Generator / Custom FitStatistical Process ControlSPC-IV Excel3D Surface AnalysisNEXIV Bird's Eye View3D Surface & Roughness AnalysisMountainsMap XGear Evaluation SoftwareGear Measurement SoftwareImage Archiving SoftwareEDF/Stitching ExpressLead Frame Measuring SoftwareVMR AutoMeasureLFNoYes

Ultrahigh-PrecisionMeasurement PlatformSmall Part Measurement PlatformNEXIV VMR-H3030NEXIV VMR-1515With ultra-high precision and versatility, this model can serve as theThe VMR-1515 series has a smaller travel (X, Y, Z) 150 x 150 x 150.master instrument in your laboratory. NEXIV VMR-H3030 achievesIt is suitable for metrology automation of small size parts.sub-micrometer level uncertainty (U1xy 0.6 µm 2L/1000 µm, U2xy0.9 3L/1000 µm) thanks to optimum layout of the ultra-preciselow-thermal expansion glass scales and robust hardware designs.Travel (X, Y, Z) 300 x 300 x 150 mm. Ideal for high precision molds.Type 1, 2, 3 ModelsType 1, 2, 3 Models Ultrahigh precision appropriate for the Master Instrument 3 models (type: 1, 2, 3) with 5-step zoom magnification to cover different fields of view and resolution requirements Wide illumination choices ensure accurate detection of edges in dies and molds Long working distance (50mm) permits measurement of parts with large height variance 15X zoom provides wide field of view for rapid search and high magnification for accurate measurement. Accuratecalibration at all magnifications allows rapid field of view measurements of multiple parameters. 3 models (type: 1, 2, 3) with 5 step zoom magnification to cover different fields of view andresolution requirements A long 50mm working distance sufficiently supports measurements of 3D workpieces 5X zoom provides wide field of view for rapid search and high magnification for accuratemeasurement. Accurate calibration at all magnifications allows rapid field of viewmeasurements of multiple parameters. High-speed TTL Laser AF ensures high-precision AF independent of surface shape.ApplicationsSemiconductor packages, Substrates, Stamped parts, Connectors and small parts, Clock partsApplicationsMaster calibration instrument for laboratory, Dies and molds, Finely machined partsConnector - Housing InsideFinely Machined Part and its 3D GraphicPGA - Insertion PinPlastic Gear Teeth with Smaller ModuleBlack Injection Molding Parts - ConnectorFlip Chip Bump and its 3D Graphic showing height distributionsZ120X Model (with Maximum Magnification Module)With an ultra-precision stage and maximum magnification module, it measures critical workpieces withZ120X Model (with Maximum Magnification Module)LU Model (universal epi-illuminator/motorized nosepiece) 120X optical magnification enables measurements of fine line widths Full range of Nikon CFI60 LU microscope objectives from 5x to 150x High-precision TTL Laser AF features high N.A. and enables Supports brightfield, darkfield, DIC, simple polarizing applicationsmeasurements of small height gapssuperior accuracy (e.g., critical dimensions on patterned masks and bump heights). Perfect for measurements of high-density, finely-machined workpieces 120X optical magnification enables measurements of rerouted patterns on wafer level CSP High precision stage facilitates accurate measurements even for wider dimensions Enables measurements of top and bottom widths of etched lines Laser AF enables measurements of micron-sized bump heights Allows evaluation of cross-sectional shapes of bumps and solder balls Optional Bird’s-Eye View software plots MEMS parts in 3D formatApplications Motorized quintuple universal nosepiece Easy to use software controls all functions of the systemApplicationsSmall-size LCDs, Organic EL panels, wafers up to 150mmSmall high-density PCBs, Small precision dies and molds,Packages (2D height), MEMS partsApplicationsWafer level CSP, Wafer level bump height, Wafer level SIP, Rerouted masks, Masks for MEMS, Fine Etching Products45

Versatile Part Measurement PlatformWide Stage Envelopment PlatformNEXIV VMR-3020NEXIV VMR-6555High-speed measurements with large 650 x 550 mm stroke stage.Optimal for measurements of PCB patterns and external dimensions of adisplay panel. You can save inspection costs by measuring a number ofsmall parts at one time after placing them together on the stage.The standard model of the NEXIV series with 300 x 200 mm stage stroke.It handles a variety of measurement tasks including those for mechanicalparts, molded parts, stamped parts and various other workpieces.Type 1, 2, 3 ModelsType 1, 2, 3 Models Variety of illumination choices facilitates accurate detection of edges in molded parts 650 x 550 mm stage stroke perfect for PCBs 3 models (type: 1, 2, 3) with 5-step zoom magnification to cover different fields of view and resolution requirements Long working distance (50mm) permits measurement of parts with large height variances 15X zoom provides wide field of view for rapid search and high magnification for accurate measurement. Accurate calibrationat all magnifications allows rapid field of view measurements of multiple parameters Laser AF enables cross-sectional shape and flatness evaluation as well as 3D profiling Automatic measurement of batches of parts by placing multiple pieces together on the stage Laser AF achieves high-accuracy measurements of bump heights Laser AF also enables measurements of height variance and warping in workpieces Search function enables measurements of lands and holes of PCBs Search function provides accurate measurements even when workpieces are not properly located on the stage Variety of illumination choices facilitate accurate edge detection even for vague geometries High-speed stage and image processing provide higher throughputApplicationsSemiconductor packages, Substrates, Stamped parts, Connectors, Injection molded partsApplicationsSemiconductor packages (multiple pieces), Substrates, Printing masks for substrates, Stamped parts (multiple pieces),Connectors (multiple pieces), Injection molded parts (multiple pieces)HDD SliderHDD Slider Height Gap ProfileBGA - Golden FingerCircuit Patterns on FlipchipMulti-Vision AF on Bonding WireZ120X Model (with Maximum Magnification Module)LU Model (universal epi-illuminator/motorized nosepiece)Its maximum magnification module achieves measurements of finelymachined workpieces. Perfect for measurements of topical MEMS parts,high-density PCBs and semiconductor packages. Full range of Nikon CFI60 LU microscope objectives from 5x to 150x The combination of the maximum magnification module and high-precision Easy to use software controls all functions of the systemstage enables accurate measurements of large geometry workpieces as wellLoop Cross SectionZ120X Model (with Maximum Magnification Module)LU Model (universal epi-illuminator/motorized nosepiece) Motorized quintuple universal nosepieceAmazing 120X zoom combined with a big stage enables ultrahighmagnification measurements on big workpieces. Ideal for measuringhigh-density PCBs and their masks. Full range of Nikon CFI60 LU microscope objectives from 5x to 150xApplications Optional surface analysis software displays 3D shapes of MEMS partsApplicationsApplicationsHigh-density PCBs, Exposure masks for substrates, Packages (2D height), MEMS partsHigh-density PCBs, Exposure masks for substrate, Semiconductor packages (multiple pieces; Laser AF uses small spot size to provide accurate measurements of finercross-sectional shapes and heightsIC Patterns - Darkfield Microscopy Supports brightfield, darkfield, DIC, simple polarizing applications Amazing 120X zoom Measurements of 1µm line widths are possible at the maximum magnification Laser AF perfect for measuring small, complicated geometries High-speed stage and image processing provide higher throughputas minute structuresCCDSmall-size LCDs, Organic EL panels, 8” (200mm) wafers Supports brightfield, darkfield, DIC, simple polarizing applications Motorized quintuple universal nosepiece Easy to use software controls all functions of the systemApplicationsFPD panels (up to 22”)2D height), Photo plotter machines for masks, Probe cards67

Ultrawide Measurement Platform47-inch Display DeviceMeasurement PlatformNEXIV VMR-10080NEXIV VMR-12072Long 1000 x 800 mm stage stroke performs brilliantly in themeasurement of large-size workpieces.Ultralong 1200 x 720 mm stage stroke allows the measurementof large workpieces such as FPD devices.Type 1, 2, 3 ModelsType 1, 2, 3 Models Long stage stroke enables measurements of LCD substrates/modules and large-size PCBs Ultralong stage stroke enables measurements of large LCD substrates/modules and PCBs 3 models (type: 1, 2, 3) with 5 step zoom magnification to cover different fields of view and resolution requirements Laser AF also enables measurements of height variance and warping in workpieces Search function facilitates measurements of lands and holes of PCBs Variety of illumination choices facilitate accurate edge detection even for vague geometries High-speed stage and high-speed image processing provide high throughput 3 models (type: 1, 2, 3) with 5 step zoom magnification to cover different fields of view and resolution requirements Laser AF enables the measurement of height gaps and warping in workpieces Search function enables measurements of lands and holes of PCBs Variety of illumination choices facilitate accurate edge detection, even for vague geometries High-speed stage and high-speed image processing provide high throughputApplicationsApplicationsPrinting masks for substrates, Mother substrates for PCBs, Shadow masks, FPD devicesLarge FPD panels and related devicesLaser Scan on FPC and its Cross SectionPhoto Mask PatternMetallized Patterns of FPCFPD-Cell ProcessLCD-TFTLCM-ACF under DIC MicroscopyColor FilterZ120X Model (with Maximum Magnification Module)LU Model (universal epi-illuminator/motorized nosepiece)Z120X Model (with Maximum Magnification Module)LU Model (universal epi-illuminator/motorized nosepiece)The model achieves ultrahigh magnification measurements with a long1000 x 800 mm stage stroke. Ideal for measuring minute line widths oflarge-size display panels. Full range of Nikon CFI60 LU microscope objectives from 5x to 150xThe model achieves ultrahigh magnification measurements with anultralong 1200 x 720 mm stage stroke, making it ideal for themeasurement of large workpieces such as FPD devices. Full range of Nikon CFI60 LU microscope objectives from 5x to 150x Automatic measurements of batches of small parts Laser AF achieves high-accuracy measurements of bump heights Laser AF enables measurements of height variance and warping in workpieces Search function enables measurements of lands and holes of PCBs Search function also provides accurate measurements even when workpiecesare not located properly on the stage Variety of illumination choices facilitate accurate edge detection even for weakedges High-speed stage and image processing provide higher throughput Supports brightfield, darkfield, DIC, simple polarizing applications Motorized quintuple universal nosepiece Easy to use software controls all functions of the systemApplicationsLarge FPD panels (up to 37”) Automatic measurement of batches of small parts Laser AF achieves highly accurate measurements of bump heights Laser AF also enables the measurements of height gaps and warping inworkpieces Search function enables measurements of lands and holes of PCBs Search function also provides accurate measurements even when workpiecesare not properly located on the stage High-speed stage and image processing provide higher throughput Supports brightfield, darkfield, DIC, simple polarizing applications Motorized quintuple universal nosepiece Easy to use software controls all functions of the systemApplicationsLarge FPD panels and related devices (up to 47”*)* Including module parts.ApplicationsApplicationsLCD glass substrates (pattern measurements),LCD glass substrates (pattern measurements),Organic EL glass substrates (pattern measurements)Organic EL glass substrates (pattern measurements)Large Size Probe Cards89

Ensure measurements with high accuracy and at high speeds.Optical Head for Type 1, 2, 3Standard head with 15X high-speed zoomWidefield, high N.A. objective lensWide choice of illumination8-sector LED ring illuminationThe standard head features 5-step, 15X high-speed zoom, providinggreater flexibility in choosing magnifications according to the size of themeasuring area.The highly corrected objective lens is equivalent to those found in Nikon'stop-end microscopes. They have a high N.A. of 0.35 with a long 50mmworking distance at all magnifications.The VMR series comes with four illuminationchoices to provide illumination perfect for theworkpiece to be measured. These include: Two LED ring illuminators—Inner (37 degreesoblique angle against Optical Axis), Outer (75degrees oblique angle) Episcopic illumination (top light) Diascopic illumination (bottom light)Edges previously difficult to capture can beIllumination windowdetected with high resolution.In addition, the VMR series features automatic light intensity control toprovide the same brightness to multiple NEXIV systems without the need toedit the teaching program*.An illumination system consisting of inner and outer ring illuminators hasbeen specially developed for the VMR series. The system makes possibleobservations of extremely low-contrast edges which are usually invisibleunder episcopic illumination by arbitrarily combining illuminations fromeight directions. Best for edgeenhancement of the contours ofbosses, pins, ceramic packages, andsimilar workpieces.Magnification vs field of view (mm)Zoom position12345Type 1 Optical magnification0.5x18x9.33 x 71x36x4.67 x 3.52x72x2.33 x 1.754x144x1.165 x 0.8757.5x270x0.622 x 0.4671x36x4.67 x 3.52x72x2.33 x 1.754x144x1.165 x 0.8758x288x0.582 x 0.43715x540x0.311 x 0.2332x72x2.33 x 1.754x144x1.165 x 0.8758x288x0.582 x 0.43716x576x0.291 x 0.21830x1080x0.155 x 0.117Total magnificationField of view (mm)Type 2 Optical magnificationTotal magnificationField of view (mm)Type 3 Optical magnificationTotal magnificationField of view (mm)Upgraded TTL Laser AFTTL Laser AF provides high resolution, long working distances, andfast operating speed for perfect focusing on narrow spaces at lowmagnifications. High-speed scanning measurement is possible at a rate of1000 points per second max., enabling ultra-precise Z-axis measurementsin a variety of applications.Total magnifications listed above represent those on the monitor screenwhen a 20” monitor is set to the UXGA (1600 x 1200 pixels) mode.Camera's zoom optics* Please ask Nikon and its authorized dealers/distributors for assistance.AF detectionopticsDichroic mirrorConnectorObjective lensHow the 8-sector LED ring illuminator worksInner ring illuminator(37 from the optical axis)This type can be universally used wheneverstrong illumination from various directionsis needed. This illumination also provides afull 50mm working distance.Laser Scan on FPC and its Cross SectionLED1XWorkpiece50mm2X Outer ring illuminator How TTL Laser AF worksEpiscopic illumination4X8XHigh-speed, high-precision Vision AFLED ring illumination(large angles of incidence)Metallized Patterns of FPC(75 from the optical axis)This type enables the observation ofworkpieces that are impossible with lightingat a shallow angle. When not in use, theilluminator retracts, creating more spaceover the workpiece. When in use, theworking distance will be 10mm.Thanks to the adoption of a new algorithm and a progressive scan CCDcamera, Vision AF now provides greater speeds and accuracy closer toTTL Laser AF. Vision AF is convenient for applications where TTL Laser AFcannot be used, for example, when focusing on chamfered or round edges.The Multiple-Vision AF enables the simultaneous measurement of multiplepoints with different heights within the field of view.Episcopic illumination15XLED ring illumination(medium angles of incidence)Color cameras can be used (optional).Surface focus10Multi-Vision AF11

With variable magnifications up to 120x,these models address applications that demand higher precision and density.Maximum Magnification Module VMR-Z120XNewly developed maximum magnification module VMR-Z120XTwo objective lenses—wide field and high power (N.A. 0.55)High-resolution TTL Laser AF with ultra tiny laser spotThree illumination typesThe new module achieves a 1x to 120X magnification range by usingtwo objectives and changing the optical path. An 8-step zoom gives thissystem the capability to do rapid field of view measurements of hundreds ofparameters and do critical measurements of line widths down to 1µm.The combination of these two objective lenses enables a broad array ofapplications ranging from wide-field observations at low magnifications toaccurate measurements at high magnifications.The module comes with a high-resolution TTL Laser AF that incorporates high N.A. objectives and achieves ultra tiny laser spots. Itsignificantly improves performance in focusing on and scanning over thin,transparent/semitransparent (e.g. resists) surfaces or irregular reflectionsurfaces. High-speed scanning measurement is possible at a rate of 1000points per second max., enabling ultra-precise Z-axis measurements in avariety of applications.The module delivers the best illumination to any workpieces by providingthree types of CNC controllable illuminations—episcopic, diascopic (highmagnification head), and darkfield illuminations. This enables edges to bedetected with high accuracy.Magnification vs field of view (mm)Optical magnificationTotal magnificationField of view (mm)1X36X4.67 3.52X72X2.33 1.754X144X1.165 0.8757.5X270X0.622 0.467Optical magnificationTotal magnificationField of view .073X0.055120X4320X0.039X0.029High magnifications darkfield illuminationCamera's zoom opticsAF detectionopticsTotal magnifications listed above represent those on the monitor screenwhen a 20” monitor is set to the UXGA (1600 x 1200 pixels) mode.Dichroic mirrorObjective lens32mmLow magnificationsWorkpiece9.8mmHow TTL Laser AF worksEpiscopic illumination1X2X4XDarkfield illumination7.5XLow magnifications darkfield illuminationHigh magnificationsMinute steps measured16X1232X64X120X (6µm linewidth)13

Nikon’s industry-acclaimed CFI60 optics supports high-precision, strain-free measurements.LU Head (LU Model)Universal epi-illuminator/motorized nosepiece typeCFI60 optical systemWide variety of CFI60 objective lensesCFI60 optics, the culmination of Nikon’s optical technologies, achievesbrilliant, high-contrast images, making the system most suitable for theobservation of large LCD substrates and color filters. This system canperform both dimensional measurements of a workpiece via imageprocessing and observation in a single unit. By using a high-contrast DICslider, enhanced DIC imaging is also possible.The CFI60 optical system creates bright, high-contrast images byminimizing flare, while offering higher numerical apertures (N.A.) andlonger working distances (W.D.). The VMR series can use a wide array ofCFI60 universal objective lenses, including the CFI LU Plan BD.CFI Objective Lenses for LCDN.A.Glass Thickness Correction RangeCFI L Plan Epi 20x CR0.450 to 1.2mmWorking Distance (t glass thickness (mm))10.9mm at t 010.5mm at t 0.610.0mm at t 1.2CFI L Plan Epi 50x CR0.70 to 1.2mm3.9mm at t 03.4mm at t 0.63.0mm at t 1.2CFI L Plan Epi 100x CRA0.850 to 0.7mm1.20mm at t 01.05mm at t 0.30.85mm at t 0.7CFI L Plan Epi 100x CRB0.850.6 to 1.3mm1.3mm at t 0.61.15mm at t 0.90.95mm at t 1.3* Working Distance varies depending on correction for glass thickness.CFI LU Plan EpiCFI LU Plan Epi ELWDMagnification and FOV SizeObjective LensWith 0.5x Tube Lens(standard)With 1.0x Tube LensCFI LU Plan BD ELWDCFI LU Plan BDCFI60 objective lensesMotorized universal nosepieceCFI LU Plan BD The CNC-based motorized nosepiece enables changes in magnificationduring the execution of a teaching program. This enables microscopy at thebest magnification and with the optimum objective lens.CFI LU Plan BD ELWD Automatic control from measurement to data processingEasy to use software controls all functions of the system. From multisource light control to image processing and stage movement, the processof measurement is automated for consistent, accurate results.The following operations are manually controlled on the LU model:Brightfield/darkfield illumination changeoverField and aperture diaphragm settingsPolarizer, analyzer, Nomarski prism settingsCFI LU Plan Epi* CFI LU Plan Epi ELWD* MagnificationN.A.W.D. .0020X0.4013.0010.1050X0.55100X0.803.50CFI LU Plan Apo BD 150X0.900.42CFI LU Plan Apo Epi* 150X0.950.305xTotal MagnificationField of View(mm)HVTotal MagnificationField of 70.031V0.7010.3500.1750.0700.0350.023* Either 0.5x Tube Lens or 1.0x Tube Lens is selectable as a factory option.Effect of LCD objective lensNomarski DIC imageDarkfield imageComparison of images observed over glass substrates.Patterns can be clearly visualized, even when viewed through glass.With DIC microscopy, small heightgaps can be visualized as brilliantcontrast images. Thus, it is possibleto observe particle distributions inACF (Anisotropic Conductive Film)bonding process.Darkfield microscopy is effective foreasy detection of small particles,scratches on a surface.With CFI LU Plan BD 20x objective lensCFI LU Plan BD 50x objective lensWith Plan EPI objective lensWith LCD objective lens*An LU objective adapter is necessary when using the EPI series of objective lenses.LU objective adapter M32-25Unit: mm1415

Edge detection with excellent precisionAdvanced intelligent searchEnhanced capabilities yet easier operationEnhances accuracy for increased productivityGray scale processing via video edge probesEnhanced edge detection with Nikon’s unique algorithmThe black and gray portions of a workpiece are digitally classified into 256levels, then edges are detected and processed based on this classification.This prevents measurement data from being affected by changes inillumination.Thanks to Nikon’s proprietary edge detection algorithm (patent pending),detection of edges at low magnifications is now possible with excellentprecision. This enables the detection of minute, low-contrast edges, a taskthat is difficult to perform using gray scale processing. Image recognitioncapability almost equal to the human eye and a detection speed among theworld’s fastest allow the system to measure any workpiece with unrivaledprecision.Video edge probes with auto “best-fit” functionWhen the operator clicks the point to be measured, the systemautomatically rotates the probes, sets them at the optimum position, andsets the probe size, all automatically.Skew alignment and deviations between the edge probing points withina workpiece are automatically corrected by a pattern-matching feature,eliminating possible measurement errors.PMM (Pattern Matching Measurement)Determines coordinate values for features too difficult to measure in thenormal geometric measuring mode.APS (Auto Position Search)Thanks to this function, the operator no longer needs to manually placemultiple workpieces in proper alignment; the NEXIV automatically searchesworkpiece position for skew alignment.Trained pattern 1Only a main edge is extracted andenhancedDrag to resize and fit the projection probeto the edgeActual searched pattern 1Processing windowSearch on left-side markSearch on right-side markAfter this processActual searched pattern 2Before APSBefore edge enhancementAfter APSProcessing windowMPS (Multi-Pattern Search)Drag to resize and fit the circle probe tothe circleAutomatically corrects deviations between the edge probing pointsprogrammed in a teaching file as well as irregular feature positions withoutedge probing error.After this processEasy selection of desired edges by eliminating dust and burrsSome workpieces contain multiple edges within a given caliper, or theircontrast is too low, making edge detection extremely difficult. This functiongraphically profiles the contrasts of the image within the caliper using amulti-gray-level scale, enabling the operator to select any one of a numberof

CNC Video Measuring Systems . NEXIV VMR-3020 Type 1, 2, 3 Models Variety of illumination choices facilitates accurate detection of edges in molded parts 3 models (type: 1, 2, 3) with 5-step zoom magnification to c